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ISL29018
Suggested PCB Footprint
It is important that the users check the “Surface Mount
Assembly Guidelines for Optical Dual FlatPack No Lead (ODFN)
Package” before starting ODFN product board mounting.
http://www.intersil.com/data/tb/TB477.pdf
Layout Considerations
The ISL29018 is relatively insensitive to layout. Like other I 2 C
devices, it is intended to provide excellent performance even in
significantly noisy environments. There are only a few
considerations that will ensure best performance.
Route the supply and I 2 C traces as far as possible from all
sources of noise. Use two power-supply decoupling capacitors
30ms
1μA
1μF and 0.1μF and place them close to the VDDA and VDDD pins
of the device.
Typical Circuit
A typical application for the ISL29018 is shown in Figure 6. The
ISL29018’s I 2 C address is internally hardwired as 1000100. The
device can be tied onto a system’s I 2 C bus together with other
I 2 C compliant devices.
Soldering Considerations
Convection heating is recommended for reflow soldering; direct-
infrared heating is not recommended. The plastic ODFN package
does not require a custom reflow soldering profile, and is
qualified to +260°C. A standard reflow soldering profile with a
+260°C maximum is recommended.
ALS
0.4ms
70μA
IR
0.4ms
70μA
PROXIMITY
IR LED
0.4ms
1mA
50mA
360 kHz
FIGURE 5. CURRENT CONSUMPTION FOR EACH INTEGRATION PHASE AND DETECTION CYCLE
1.7V TO 3.63V
R1
10k Ω
R2
10k Ω
R3
10k Ω
I 2 C MASTER
MICROCONTROLLER
INT
2.25V TO 3.63V
SDA
SCL
SLAVE_0
SLAVE_1
I 2 C SLAVE_n
1
2
VDDD
VDDA
IRDR
INT
8
7
SDA
SCL
SDA
SCL
C1
1μF
C2
0.1μF
3
4
GND
REXT
SDA
SCL
6
5
REXT
499k
ISL29018
FIGURE 6. ISL29018 TYPICAL CIRCUIT
14
FN6619.4
October 8, 2012
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